Micron Memory Part Number Decoder -
The Ultimate Guide to the Micron Memory Part Number Decoder In the world of high-performance computing, the string of characters etched onto a RAM chip or printed on an SSD label isn't just a serial number—it’s a dense, encoded biography of the hardware. Whether you are a system builder, an overclocker, or a curious tech enthusiast, understanding the Micron part number decoder
The Ultimate Guide to Decoding Micron Memory Part Numbers Micron Technology is a global leader in semiconductor systems. Their components power everything from consumer smartphones to enterprise data centers.
: Highly optimized, mature production revision (frequently prized by overclockers for stability).
: Marks the die generation or manufacturing stepping. 💾 Section 1: Decoding Micron DRAM Part Numbers micron memory part number decoder
If you are currently trying to decode a specific string, tell me: The or 5-digit FBGA code The device it came from (e.g., server, laptop, custom PCB)
1. Understanding the Micron Part Number Structure (DRAM Component)
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Confirm speed grades, densities, and operational voltages before installation.
Micron modules (DIMMs, SODIMMs, RDIMMs) use a different format.
While the string of characters looks cryptic at first glance, it follows a logical structure. This guide will help you decode a Micron part number (PN) to determine the density, speed, form factor, and package type without needing a datasheet. Micron modules (DIMMs
A standard Micron DRAM component part number (e.g., MT48LC16M8A2TG-75 ) consists of distinct fields:
| Position | Code | Meaning | | :--- | :--- | :--- | | | MT | Micron Technology (Standard Memory) | | Type | 4 | DRAM (Dynamic RAM) | | | H | Hybrid Memory Cube (HMC) | | Density | 4G | 4 Gigabits | | | 8G | 8 Gigabits | | | 16G | 16 Gigabits | | | 40 | 4 Gigabits (Alt designation) | | | 80 | 8 Gigabits (Alt designation) | | Generation | A | SDR SDRAM | | | B | DDR SDRAM | | | C | DDR2 SDRAM | | | D | DDR3 SDRAM | | | E | DDR4 SDRAM | | | F | DDR5 SDRAM | | | H | LPDDR / LPDDR2 / LPDDR3 / LPDDR4 / LPDDR5 | | | J | GDDR5 / GDDR5X / GDDR6 | | | V | RLDRAM (Reduced Latency) | | | T | Mobile LPDRAM (Low Power) | | Speed | (Varies) | Data Transfer Rate | | | DDR4 Examples: AT (DDR4-2133), 8G (DDR4-3200) | | | DDR5 Examples: BG (DDR5-4800), CK (DDR5-5600) | | | See speed tables below | | Org | 08 | x8 (8-bit wide data bus) | | | 16 | x16 (16-bit wide data bus) | | | 04 | x4 (4-bit wide data bus) | | Package | G | FBGA (Fine-pitch Ball Grid Array) | | | J | BGA (Standard Ball Grid Array) | | | M | TSOP (Thin Small Outline Package) | | Temp Grade | C | Commercial (0°C to +70°C) | | | I | Industrial (-40°C to +85°C) | | | E | Extended (-25°C to +85°C) | | | A | Automotive (-40°C to +95°C) | | | IT | Industrial Temperature (Often used in newer parts) | | Process/Rev | -XX | Die Revision or Manufacturing Process Code (e.g., -093, -AAT) |